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Physical Design for Multichip Modules by Mysore Sriram (English) Paperback Book
AU $352.90
大約HK$ 1,748.04
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所在地：Melbourne, 澳洲
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- ISBN-13
- 9781461361534
- Book Title
- Physical Design for Multichip Modules
- ISBN
- 9781461361534
關於產品
Product Information
Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Product Identifiers
Publisher
Springer-Verlag New York Inc.
ISBN-13
9781461361534
eBay Product ID (ePID)
189310734
Product Key Features
Number of Pages
197 Pages
Publication Name
Physical Design for Multichip Modules
Language
English
Subject
Computer Science, Physics
Publication Year
2012
Type
Textbook
Subject Area
Electrical Engineering
Format
Paperback
Dimensions
Item Height
235 mm
Item Weight
338 g
Item Width
155 mm
Volume
267
Additional Product Features
Country/Region of Manufacture
United States
Series Title
The Springer International Series in Engineering and Computer Science
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賣家公司資料
增值稅編號： AU 82107909133, GB 293967539
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賣家信用評價 （1,460,679）
- 9***e (225)- 買家留下的信用評價。過去 1 個月購買已獲認證Item in great quality and condition! Price is right and looks great! Would recommend! 👍👍👍
- r***1 (26)- 買家留下的信用評價。過去 1 個月購買已獲認證Thankyou very much I will find very handy
- 2***g (556)- 買家留下的信用評價。過去 1 個月購買已獲認證Great transaction