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Reactive Sputter Deposition - Springer Series - 10978354076662
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物品細節
- 物品狀況
- Book Title
- Reactive Sputter Deposition
- ISBN
- 9783540766629
關於產品
Product Identifiers
Publisher
Springer Berlin / Heidelberg
ISBN-10
3540766626
ISBN-13
9783540766629
eBay Product ID (ePID)
65584333
Product Key Features
Number of Pages
Xviii, 572 Pages
Publication Name
Reactive Sputter Deposition
Language
English
Publication Year
2008
Subject
Physics / Condensed Matter, Materials Science / Thin Films, Surfaces & Interfaces, Chemistry / Physical & Theoretical, Physics / General
Type
Textbook
Subject Area
Technology & Engineering, Science
Series
Springer Series in Materials Science Ser.
Format
Hardcover
Dimensions
Item Weight
40.7 Oz
Item Length
9.3 in
Item Width
6.1 in
Additional Product Features
Intended Audience
Scholarly & Professional
Dewey Edition
22
Series Volume Number
109
Number of Volumes
1 vol.
Illustrated
Yes
Dewey Decimal
621.38152
Table Of Content
Simulation of the Sputtering Process.- Electron Emission from Surfaces Induced by Slow Ions and Atoms.- Modeling of the Magnetron Discharge.- Modelling of Reactive Sputtering Processes.- Depositing Aluminium Oxide: A Case Study of Reactive Magnetron Sputtering.- Transport of Sputtered Particles Through the Gas Phase.- Energy Deposition at the Substrate in a Magnetron Sputtering System.- Process Diagnostics.- Optical Plasma Diagnostics During Reactive Magnetron Sputtering.- Reactive Magnetron Sputtering of Indium Tin Oxide Thin Films: The Cross-Corner and Cross-Magnetron Effect.- Reactively Sputter-Deposited Solid Electrolytes and Their Applications.- Reactive SputteredWide-Bandgap p-Type Semiconducting Spinel AB2O4 and Delafossite ABO2 Thin Films for "Transparent Electronics".- Oxide-Based Electrochromic Materials and Devices Prepared by Magnetron Sputtering.- Atomic Assembly of Magnetoresistive Multilayers.
Synopsis
In this valuable work, all aspects of the reactive magnetron sputtering process, from the discharge up to the resulting thin film growth, are described in detail, allowing the reader to understand the complete process. Hence, this book gives necessary information for those who want to start with reactive magnetron sputtering, understand and investigate the technique, control their sputtering process and tune their existing process, obtaining the desired thin films., The most straightforwardmethod to change the surface properties of a ma- rial is to deposit a thin ?lm or coating on it. Hence, it is not surprising that an overwhelming amount of scienti?c and technical papers is published each year on this topic. Sputter deposition is one of the many so-called physical vapour deposition (PVD) techniques. In most cases, sputter deposition uses a magnetically enhanced glow discharge or magnetron discharge to produce the ions which bombard and sputter the cathode material. In the ?rst chapter of this book (Chap. 1), the details of the sputter process are discussed. Essential to sustain the discharge is the electron emission during ion bombardment. Indeed, the emitted electrons are accelerated from the target and can ionize gas atoms. The formed ions bombard again the target completing the s- taining process. A complete chapter is assigned to this process to highlight its importance (Chap. 2). Although the sustaining process can be described quite straightforward, a complete understanding of the magnetron discharge and the in?uence of di?erent parameters on the discharge characteristics is onlypossiblebymodelling(seeChap.3).Withthesethreechapters, thereader should be able to form an idea of the target and plasma processes occurring during a DC magnetron discharge, The most straightforwardmethod to change the surface properties of a ma- rial is to deposit a thin ?lm or coating on it. Hence, it is not surprising that an overwhelming amount of scienti'c and technical papers is published each year on this topic. Sputter deposition is one of the many so-called physical vapour deposition (PVD) techniques. In most cases, sputter deposition uses a magnetically enhanced glow discharge or magnetron discharge to produce the ions which bombard and sputter the cathode material. In the ?rst chapter of this book (Chap. 1), the details of the sputter process are discussed. Essential to sustain the discharge is the electron emission during ion bombardment. Indeed, the emitted electrons are accelerated from the target and can ionize gas atoms. The formed ions bombard again the target completing the s- taining process. A complete chapter is assigned to this process to highlight its importance (Chap. 2). Although the sustaining process can be described quite straightforward, a complete understanding of the magnetron discharge and the in'uence of di'erent parameters on the discharge characteristics is onlypossiblebymodelling(seeChap.3).Withthesethreechapters,thereader should be able to form an idea of the target and plasma processes occurring during a DC magnetron discharge., The most straightforwardmethod to change the surface properties of a ma- rial is to deposit a thin ?lm or coating on it. Hence, it is not surprising that an overwhelming amount of scienti?c and technical papers is published each year on this topic. Sputter deposition is one of the many so-called physical vapour deposition (PVD) techniques. In most cases, sputter deposition uses a magnetically enhanced glow discharge or magnetron discharge to produce the ions which bombard and sputter the cathode material. In the ?rst chapter of this book (Chap. 1), the details of the sputter process are discussed. Essential to sustain the discharge is the electron emission during ion bombardment. Indeed, the emitted electrons are accelerated from the target and can ionize gas atoms. The formed ions bombard again the target completing the s- taining process. A complete chapter is assigned to this process to highlight its importance (Chap. 2). Although the sustaining process can be described quite straightforward, a complete understanding of the magnetron discharge and the in?uence of di?erent parameters on the discharge characteristics is onlypossiblebymodelling(seeChap.3).Withthesethreechapters,thereader should be able to form an idea of the target and plasma processes occurring during a DC magnetron discharge.
LC Classification Number
TA418.7-418.76
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