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Micro- and Opto-Electroni
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所在地：Cedar Rapids, Iowa, 美國
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物品細節
- 物品狀況
- 很新
- 賣家備註
- “Lightly used. Like New!!”
- PublishedOn
- 2007-05-09
- Unit Type
- Unit
- Book Title
- Micro- and Opto- Electronic Materials and Structures Volume 1 & 2
- Narrative Type
- Nonfiction
- Educational Level
- Vocational School
- Personalized
- No
- Level
- Advanced
- Features
- 1st Edition
- Topic
- Physics
- Country/Region of Manufacture
- United States
- Subjects
- Engineering & Technology
- ISBN
- 9780387279749
關於產品
Product Identifiers
Publisher
Springer
ISBN-10
0387279741
ISBN-13
9780387279749
eBay Product ID (ePID)
53563535
Product Key Features
Number of Pages
Lxii, 1460 Pages
Publication Name
Micro- And Opto-Electronic Materials and Structures : Physics, Mechanics, Design, Reliability and Packaging
Language
English
Subject
Industrial Design / General, Electronics / Optoelectronics, Electrical, Electronics / General, Materials Science / Electronic Materials
Publication Year
2007
Type
Textbook
Subject Area
Technology & Engineering
Format
Hardcover
Dimensions
Item Weight
113.9 Oz
Item Length
10 in
Item Width
7 in
Additional Product Features
Intended Audience
Scholarly & Professional
LCCN
2006-922729
Dewey Edition
22
Reviews
From the reviews: "The book contains 25 chapters written by experts, mainly drawn from the United States and Europe. The chapters contain good technical details and thorough reference lists, and most of the figures are high quality. ... For those engaged in developing MOEMS products and similar activities, the acquisition of this book ... will be a sound investment." (K. Alan Shore, Optics and Photonics News, November, 2007), From the reviews: "The book contains 25 chapters written by experts, mainly drawn from the United States and Europe. The chapters contain good technical details and thorough reference lists, and most of the figures are high quality. … For those engaged in developing MOEMS products and similar activities, the acquisition of this book … will be a sound investment." (K. Alan Shore, Optics and Photonics News, November, 2007), From the reviews:"The book contains 25 chapters written by experts, mainly drawn from the United States and Europe. The chapters contain good technical details and thorough reference lists, and most of the figures are high quality. … For those engaged in developing MOEMS products and similar activities, the acquisition of this book … will be a sound investment." (K. Alan Shore, Optics and Photonics News, November, 2007)
Number of Volumes
2 vols.
Illustrated
Yes
Dewey Decimal
621.381
Table Of Content
Materials Physics.- Polymer Materials Characterization, Modeling and Application.- Thermo-Optic Effects in Polymer Bragg Gratings.- Photorefractive Materials and Devices for Passive Components in WDM Systems.- Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability.- Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges.- Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems.- Materials Mechanics.- Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension.- Area Array Technology for High Reliability Applications.- Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections.- Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections.- Fatigue Life Assessment for Lead-Free Solder Joints.- Lead-Free Solder Materials: Design For Reliability.- Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures.- Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods.- Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach.- Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension.- Dynamic Physical Reliability in Application to Photonic Materials.- High-Speed Tensile Testing of Optical Fibers-- New Understanding for Reliability Prediction.- The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior.- Effect of Material's Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems.- Physical Design.- Analytical Thermal Stress Modeling in Physical Design for Reliability of Micro- andOpto-Electronic Systems: Role, Attributes, Challenges, Results.- Probabilistic Physical Design of Fiber-Optic Structures.- The Wirebonded Interconnect: A Mainstay for Electronics.- Metallurgical Interconnections for Extreme High and Low Temperature Environments.- Design, Process, and Reliability of Wafer Level Packaging.- Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow.- Reliability and Packaging.- Fundamentals of Reliability and Stress Testing.- How to Make a Device into a Product: Accelerated Life Testing (ALT), Its Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Tests.- Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique.- Interconnect Reliability Considerations in Portable Consumer Electronic Products.- MEMS Packaging and Reliability.- Advances in Optoelectronic Methodology for MOEMS Testing.- Durability of Optical Nanostructures: Laser Diode Structures and Packages, A Case Study.- Review of the Technology and Reliability Issues Arising as Optical Interconnects Migrate onto the Circuit Board.- Adhesives for Micro- and Opto-Electronics Application: Chemistry, Reliability and Mechanics.- Multi-Stage Peel Tests and Evaluation of Interfacial Adhesion Strength for Micro- and Opto-Electronic Materials.- The Effect of Moisture on the Adhesion and Fracture of Interfaces in Microelectronic Packaging.- Highly Compliant Bonding Material for Micro- and Opto-Electronic Applications.- Adhesive Bonding of Passive Optical Components.- Electrically Conductive Adhesives: A Research Status Review.- Electrically Conductive Adhesives.- Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging.- Die Attach Quality Testing by StructureFunction Evaluation.- Mechanical Behavior of Flip Chip Packages under Thermal Loading.- Stress Analysis for Processed Silicon Wafers and Packaged Micro-devices.
Synopsis
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore, practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions. Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book., The first comprehensive reference containing practical and easy-to-use information on micro- and opto-electronic materials. It details their assemblies, structures and systems, and gives practical recommendations on how to apply current knowledge in this field.
LC Classification Number
TK7800-8360
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