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Antenna-in-Package Technology and Applications by Duixian Liu (English) Hardcove

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ISBN-13
9781119556633
Book Title
Antenna-in-Package Technology and Applications
ISBN
9781119556633
Publication Year
2020
Type
Textbook
Format
Hardcover
Language
English
Publication Name
Antenna-In-Package Technology and Applications
Item Height
246mm
Author
Duixian Liu, Yueping Zhang
Publisher
John Wiley and Sons Ltd
Item Width
162mm
Subject
Engineering & Technology
Item Weight
756g
Number of Pages
416 Pages

關於產品

Product Information

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors-well-known experts on the topic-explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging-based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit-based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: * Includes a brief history of antenna-in-package technology * Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) * Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Product Identifiers

Publisher
John Wiley and Sons Ltd
ISBN-13
9781119556633
eBay Product ID (ePID)
23046414314

Product Key Features

Author
Duixian Liu, Yueping Zhang
Publication Name
Antenna-In-Package Technology and Applications
Format
Hardcover
Language
English
Subject
Engineering & Technology
Publication Year
2020
Type
Textbook
Number of Pages
416 Pages

Dimensions

Item Height
246mm
Item Width
162mm
Item Weight
756g

Additional Product Features

Title_Author
Duixian Liu, Yueping Zhang
Series Title
Wiley-IEEE
Country/Region of Manufacture
United States

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增值稅識別編號:
  • AU 82107909133
  • GB 293967539
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