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Preventing Thermal Cycling and Vibration Failures in Electronic Equipment: New
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所在地：Sparks, Nevada, 美國
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- Book Title
- Preventing Thermal Cycling and Vibration Failures in Electronic E
- Publication Date
- 2001-07-11
- Pages
- 304
- ISBN
- 9780471357292
- Subject Area
- Technology & Engineering, Science
- Publication Name
- Preventing Thermal Cycling and Vibration Failures in Electronic Equipment
- Publisher
- Wiley & Sons, Incorporated, John
- Item Length
- 9.3 in
- Subject
- Waves & Wave Mechanics, Electrical, Electronics / General
- Publication Year
- 2001
- Type
- Textbook
- Format
- Hardcover
- Language
- English
- Item Height
- 1.2 in
- Item Weight
- 21.6 Oz
- Item Width
- 6.5 in
- Number of Pages
- 304 Pages
關於產品
Product Identifiers
Publisher
Wiley & Sons, Incorporated, John
ISBN-10
0471357294
ISBN-13
9780471357292
eBay Product ID (ePID)
1928837
Product Key Features
Number of Pages
304 Pages
Language
English
Publication Name
Preventing Thermal Cycling and Vibration Failures in Electronic Equipment
Subject
Waves & Wave Mechanics, Electrical, Electronics / General
Publication Year
2001
Type
Textbook
Subject Area
Technology & Engineering, Science
Format
Hardcover
Dimensions
Item Height
1.2 in
Item Weight
21.6 Oz
Item Length
9.3 in
Item Width
6.5 in
Additional Product Features
Intended Audience
Scholarly & Professional
LCCN
2001-024704
Reviews
"...text s purpose is to show manufacturers how to design, analyze, and evaluate electronic systems for lower cost and improved reliability in harsh environments..." (SciTech Book News, Vol. 25, No. 4, December 2001), "...text's purpose is to show manufacturers how to design, analyze, and evaluate electronic systems for lower cost and improved reliability in harsh environments..." (SciTech Book News, Vol. 25, No. 4, December 2001)
Dewey Edition
21
Illustrated
Yes
Dewey Decimal
621.381/04
Table Of Content
Preface. Symbols. Physics of Failure In Electronic Systems. Thermal Expansion Displacements, Forces, and Stresses. Vibration of Beams and Other Simple Structures. Vibration of Printed Circuit Boards and Flat Plates. Estimating Fatigue Life in Thermal Cycling and VibrationEnvironments. Octave Rule, Snubbers, Dampers, and Isolation for PreventingVibration Damage to Electronic Systems. Displacements, Forces, and Stresses in Axial Leaded ComponentWires Due to Thermal Expansions. Designing Electronic Equipment for Sinusoidal Vibration. Assessment of Random Vibration on Electronic Design. Combining Fatigue Damage for Random Vibration and Thermal Cycling. Thermal Cycling Failures in Surface-Mounted Components. Stresses and Fatigue Life in Component Lead Wires and SolderJoints Due to Dynamic Forces and PCB Displacements. Fatigue Life of Long Components, Tall Components, and SmallComponents Mounted on PCBs. Wear and Interface Surface Fretting Corrosion in ElectricalConnectors. Case Histories of Failures and Failure Analyses. Bibliography. Index.
Synopsis
This book deals with the packaging of electronic equipment to prevent damage from vibration and exposure to large variations in temperature.
LC Classification Number
TK7870.25.S7324 2001
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