回到首頁
|刊登類別：
|
加入追蹤清單

第 1/9 張圖片

AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 1/9 張圖片
AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 2/9 張圖片
AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 3/9 張圖片
AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 4/9 張圖片
AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 5/9 張圖片
AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 6/9 張圖片
AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 7/9 張圖片
AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 8/9 張圖片
AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo - 第 9/9 張圖片
有類似物品要出售？
自己賣

AREA ARRAY PACKAGING HANDBOOK: MANUFACTURING AND ASSEMBLY By Ken Gilleo

狀況：
很好
價格：
US $20.00
大約HK$ 156.26
講價：
運費：
US $46.00（大約 HK$ 359.39） Overnight shipping. 查看詳情— 運送
所在地：Daleszyce, 波蘭
送達日期：
視情況而定
退貨：
保障：
請參閱物品說明或聯絡賣家以取得詳細資料。閱覽全部詳情查看保障詳情
（不符合「eBay 買家保障方案」資格）

賣家資料

檢舉物品 — 會在新視窗或分頁中開啟
賣家必須承擔此刊登物品的所有責任。
eBay 物品編號：385780145071

物品細節

物品狀況
很好: ...
Subject Area
Technology & Engineering, Business & Economics
Book Title
Area Array Packaging Handbook: Manufacturing and Assembly
ISBN-10
0071374930
Subject
Industries / Computers & Information Technology, Telecommunications
ISBN
9780071374934
Publication Name
Area Array Packaging Handbook: Manufacturing and Assembly
Item Length
9.3 in
Publisher
McGraw-Hill Professional Publishing
Publication Year
2001
Type
Textbook
Format
Hardcover
Language
English
Item Height
2.3 in
Author
Ken Gilleo
Item Width
7.6 in
Item Weight
61.6 Oz
Number of Pages
1000 Pages

關於產品

Product Information

Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)

Product Identifiers

Publisher
McGraw-Hill Professional Publishing
ISBN-10
0071374930
ISBN-13
9780071374934
eBay Product ID (ePID)
1923721

Product Key Features

Author
Ken Gilleo
Publication Name
Area Array Packaging Handbook: Manufacturing and Assembly
Format
Hardcover
Language
English
Subject
Industries / Computers & Information Technology, Telecommunications
Publication Year
2001
Type
Textbook
Subject Area
Technology & Engineering, Business & Economics
Number of Pages
1000 Pages

Dimensions

Item Length
9.3 in
Item Height
2.3 in
Item Width
7.6 in
Item Weight
61.6 Oz

Additional Product Features

LCCN
2001-041051
Lc Classification Number
Tk7870.15.G54 2002
Table of Content
Forword Section 1: Packaging Concepts and Design Chapter 1: Introduction to Electronic Packaging Chapter 2: Electronics Industry Overview Chapter 3: Trends/Drivers in the Electronics Manufacturing Industry Chapter 4: Area Array Packaging Chapter 5: Stacked/3D Packages Chapter 6: Compliant IC Packaging Chapter 7: Flip Chip Technology Chapter 8: Options in High-Density Part Cleaning Chapter 9: MEMS Packaging and Assembly Challenges Chapter 10: Ceramic Ball and Column Grid Array Overview Section 2: Materials Chapter 11: Polyer Packaging Materials: Adhesives, Encapsulants, and Underfills Chapter 12: Hermetic Packaging Systems: Adhesive and Getter Chapter 13: Area Array Solder Spheres, Pastes, and Fluxes Chapter 14: Modern Solder and Solder Paste Chapter 15: Lead-Free Systems and Process Implications Chapter 16: Electrically Conductive Adhesives for Surface-Mount and Flip Chip Processes: An Alternative to Solder? Section 3: Equipment and Processes Chapter 17: Next-Generation Flip Chip Materials and Processes Chapter 18: Flip Chip Assembly and Underfilling Chapter 19: BGA and CSP Rework: What is Involved? Chapter 20: BGA Assembly Reliability Chapter 21: Die Attach and Rework Chapter 22: Liquid Encapsulation Equipment and Processes Chapter 23: Molding for Area Array Packages Chapter 24: Screen Printing and Stenciling Chapter 25: Criteria for Placement and Processing of Advanced Packages Chapter 26: Ovens in Electronics Chapter 27: Process Development, Control, and Organization Section 4: Economics and Productivity Chapter 28: Metrics: The Key to Productivity Chapter 29: Cost Estimating for Electronic Assembly Section 5: Future Chapter 30: The Future of Electronic Packaging Chapter 31: The Future of SMT Process Equipment Index
Copyright Date
2002
Target Audience
Scholarly & Professional
Dewey Decimal
621.381/046
Dewey Edition
21
Illustrated
Yes

賣家提供的物品說明

parmigi74

parmigi74

100% 正面信用評價
已賣出 10 件物品
賣家的其他物品聯絡
通常在 24 小時內回覆