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Lead-free Solders: Materials Reliability for El, Subramanian+=
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大約HK$ 2,040.09
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所在地：MD, 美國
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估計於 9月30日, 一至 10月4日, 五之間送達 運送地點 43230
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- PublishedOn
- 2012-03-09
- Title
- Lead-free Solders: Materials Reliability for Electronics (Wiley
- ISBN
- 9780470971826
- Subject Area
- Technology & Engineering
- Publication Name
- Lead-Free Solders : Materials Reliability for Electronics
- Publisher
- Wiley & Sons, Incorporated, John
- Item Length
- 9.9 in
- Subject
- Materials Science / Metals & Alloys, Manufacturing
- Publication Year
- 2012
- Series
- Wiley Series in Materials for Electronic and Optoelectronic Applications Ser.
- Type
- Textbook
- Format
- Hardcover
- Language
- English
- Item Height
- 1.1 in
- Item Weight
- 32.1 Oz
- Item Width
- 6.9 in
- Number of Pages
- 520 Pages
關於產品
Product Identifiers
Publisher
Wiley & Sons, Incorporated, John
ISBN-10
0470971827
ISBN-13
9780470971826
eBay Product ID (ePID)
154318281
Product Key Features
Number of Pages
520 Pages
Language
English
Publication Name
Lead-Free Solders : Materials Reliability for Electronics
Publication Year
2012
Subject
Materials Science / Metals & Alloys, Manufacturing
Type
Textbook
Subject Area
Technology & Engineering
Series
Wiley Series in Materials for Electronic and Optoelectronic Applications Ser.
Format
Hardcover
Dimensions
Item Height
1.1 in
Item Weight
32.1 Oz
Item Length
9.9 in
Item Width
6.9 in
Additional Product Features
Edition Number
2
Intended Audience
Scholarly & Professional
LCCN
2011-038790
Dewey Edition
23
Illustrated
Yes
Dewey Decimal
621.381
Synopsis
Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met., Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage.
LC Classification Number
TK7836.S825 2012
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增值稅識別編號：
- GB 724498118
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